亚洲在线日韩伦理片,96精品国产AⅤ一区二区,青鸟影视网,yy黄色频道,国内精品久久久精品AV电影院

 Editor's Summary * Ultra-compact personal AI workstation featuring the NVIDIA? GB10 Grace Blackwell Superchip, equipped with 128 GB of unified memory, 4 TB of storage, and delivering up to 1 PFLOPS of FP4 AI performance. * Designed to work locally with large AI models, and scale to larger wo...

 - ? ?Brings ASML's EXE:5200B, critical system for next-generation chips, to M16 fab - ? ?Improved precision, density by 1.7x and 2.9x to help competitive production - ? ?Company to lead AI memory with cutting-edge tech required by key industries SEOUL, South Korea, Sept. 2, 2025 /PRNewswire/ -- ...

HSINCHU, Sept. 2, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150  and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"),...

 * Company first in industry to develop High-K EMC material, improves thermal conductivity by 3.5 times, thermal resistance by 47% * Customers expect achievement to help address heat issue generated from on-device AI * SK hynix to lead next-generation DRAM for mobile device through technolog...

 * Development of the industry's highest-density QLC product completed, commercial launch scheduled for the first half of next year following completion of customer validation * Expansion of independent operation units ("planes") enables simultaneous large capacity and high performance, optimi...

 * Received the highest grade for the entire R&D process, from design to quality verification * Plans to mass-produce 20 million units of 16 major semiconductors developed in-house this year, and has established an R&D environment at the global top level * Takes the lead in expanding the dom...

 KYOTO, Japan, Aug. 21, 2025 /PRNewswire/ --?ROHM Co., Ltd. has launched the AW2K21, a 30V?N-channel MOSFET in a common-source configuration that delivers an industry-best* ON-resistance of 2.0 milliohms (typ.) in a compact 2.0mm x 2.0mm WLCSP package. This innovation addresses the growing demand ...

 * 2Q25 Revenue Grew 3.7% Compared to 1Q25 * 6.6% 2Q25 Gross Margin Compared to 9.4% in 1Q25 * Overall Utilization Rate Increased to 65% from 62% in 1Q25 * NT$1,667.2 Million or US$57.1 Million Net Free Cash Flow for the First Half of 2025 * Revenue Growth and Prudent CapEx Further Strengt...

HSINCHU, Aug. 8, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150  and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"), ...

HSINCHU, July 29, 2025 /PRNewswire-FirstCall/ --?ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150  and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"),...

 One-Stop Platform in Taiwan for Equipment Validation and Talent Training to Accelerate AI-based Manufacturing Worldwide TAIPEI, July 25, 2025 /PRNewswire/ -- Delta, a global leader in power management and smart green solutions, today inaugurated inTaiwan its Smart Manufacturing Innovation Center...

 * Reports revenues of 22.232 trillion won, operating profit of 9.2129 trillion won, net profit of 6.9962 trillion won * Both revenues, operating profit at all-time highs following brisk sales of AI memory * Company to provide best-in-class AI products timely for customer satisfaction, marke...

HSINCHU, July 21, 2025 /PRNewswire-FirstCall/ -- ChipMOS TECHNOLOGIES INC. ("ChipMOS" or the "Company") (Taiwan Stock Exchange:8150  and Nasdaq: IMOS), an industry leading provider of outsourced semiconductor assembly and test services ("OSAT"),...

 SEOUL, South Korea, July 17, 2025 /PRNewswire/ -- SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced that it has submitted its preliminary IPO application to the Korea Exchange (KRX), marking the official start of its listing proce...

 HSINCHU, July 15, 2025 /PRNewswire/ -- InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC's Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universa...